The Third International Symposium on
3D Power Electronics Integration and Manufacturing

3D-PEIM 2020

Osaka University, Japan
June 22-24, 2020

Call for Papers Announced – Deadline December 15, 2019

The Third International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-20) will be held on June 22-24, 2020.  This symposium will be held at the Osaka University, Suita Campus in Japan. This is the first time to have this symposium outside the USA. It will include worldwide experts representing a wide range of disciplinary perspectives to advance the development of future 3D power electronics systems. Asia is the factory of the world and has a big customer base for advanced power electronics technology. 3D-PEIM is an excellent opportunity to learn about leading edge R&D innovations in 3D power packaging. The focus of the symposium will be on additive, embedded, co-designed, and integrative packaging technologies and the symposium will emphasize the need to address mechanical, materials, reliability, and manufacturability issues in small, smart, power dense components and modules.

The conference will feature invited lectures highlighted by a keynote addresses from Industry experts.  There will also be tutorials, technical sessions that include contributed presentations, exhibits, and an interactive poster/demonstration session. The symposium is being organized by the Power Sources Manufacturers Association (www.psma.com), and will be chaired by Prof. Tsuyoshi Funaki of the Osaka University, Japan.

If you are interested in learning more, please contact info@3D-PEIM.Org, or the PSMA office at power@psma.com.  We look forward to seeing you in Osaka university this coming June 2020

Prof. Tsuyoshi Funaki, Osaka University, Japan General Chairman
Prof. Katsuaki Suganuma, Osaka University, Japan Technical Program Co-Chairman	Prof. Guo Quan Lu, Virginia Tech, U.S.A. Technical Program Co-Chairman

Other Organizing Committee Members

Prof. Patrick McCluskey, University of Maryland U.S.A. – Past General Chairman and Assistant to General Chair
Dr. Minoru Ueshima, Daicel Corporation, Japan – Assistant to Technical Program Co-Chairman
Brian Narveson, Narveson Consulting, U.S.A – Finance Chairman
Arnold Alderman, Anagenesis, Inc. U.S.A. – Publicity Chairman
John Bultitude, Kemet USA – Publications Chairman
Prof. Doug Hopkins North Carolina State University, U.S.A. – Past General Chairman and advisor
Joe Horzepa U.S.A. – Executive Director of PSMA

If you wish to be a member of the Technical Program Committee, please contact any of the organizers or this website.

3D-PEIM 2018

June 25-27, 2018

Adele H. Stamp Student Union, University of Maryland, College Park, MD USA

PACKAGING is a Design Function
MANUFACTURING provides the Design Rules

PSMA Sponsored second International Symposium on 3D Power Electronics Integration and Manufacturing (3D PEIM) was another success! On June 25-27, 2018, over 70 participants, 22 from outside the US, attended the event in College Park, Maryland.

Prior to the technical program, three tutorials were given by leading experts on additive manufacturing and power electronics system integration: “Additive Manufacturing” by Prof. Christopher Williams of Virginia Tech; “System Integration” by Prof. Douglas Hopkins of NC State University; and “Integrated Thermal Packaging” by Prof. Michael Ohadi of University of Maryland. Attendee reviews of the tutorials were outstanding with over 90% feeling that they increased their knowledge from the Symposium.

The Symposium opened with two outstanding keynote talks given by two leading researchers in power packaging: “Small, Quiet, Robust, and Affordable: Delivering the Integrated Promise” by Prof. Mark Johnson, University of Nottingham, UK; and “Embedding Technologies for Planar Power Electronics Modules” by Prof. Rolf Aschenbrenner, Fraunhofer Institute-Berlin, Germany.

Attendees were able to attend every presentation in the 3DPEIM high-value single-track technical program featuring 34 oral presentations divided into eight topical sessions, each with a keynote speaker followed by three invited/contributed talks. Over 80% of the oral talks were invited. The presenters and attendees engaged in lively discussions during the sessions and had many networking breaks.  In addition, 19 posters were displayed during a meaningful interactive session with the displaying students.  Participant feedback stated that 90% of attendees felt the presented material was high quality and they were interested in attending a future 3D-PEIM Symposia.

The presentations from this Symposium are available to PSMA members and Symposium attendees until April 30, 2019 after which they will be available to the public.

The Symposium was sponsored by the Power Sources Manufacturers Association (www.psma.com), with IEEE EPS as a technical sponsor. It was also support financially by 2 industry sponsors, Pink GmbH and Kemet, plus 3 academic sponsors, CALCE at University of Maryland, CPES at Virginia Tech, and the FREEDM Systems Center at NCSU.

Planning for 3D-PEIM 2020 has begun. If you are interested in participating or sponsoring, please  contact info@3D-PEIM.Org, or the PSMA office at power@psma.com.

A special thanks to Prof. Patrick McCluskey, General Chair (in photo on right) and Prof. G-Q. Lu, Technical Program Chair (on left)