The Third International Symposium on
3D Power Electronics Integration and Manufacturing

3D-PEIM 

June 21-23 2021 at Osaka University, Japan

Attend In-person or Virtually

PSMA announces the opening of the Third Biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-21), to be held June 21-23, 2021. It is the first time to have this 3D-PEIM outside the USA. Asia is the world’s factory and has a significant customer base for advanced power electronics, so it is appropriate to hold this Symposium in Japan at the Osaka University, Suita Campus, Graduate School of Engineering.

Due to the unforeseen status of the COVID-19 pandemic next June, we have cautiously decided to hold an in-person/virtual hybrid event. Anyone can attend either in person or virtual. Presentations will be live from both in-person and virtual presenters. All presentations will be recorded and available to paid attendees. Attendees may switch registration between virtual and in-person up to one month before the Symposium.

3D-PEIM has successfully re-invited all the postponed 2020 program world-class experts to present in 2021. Continuing the 2016 and 2018 Symposia’s success, 3D-PEIM-21 again assembles world-class experts representing a far-reaching range of disciplinary perspectives exploring the path to the development and manufacture of future 3D power electronics systems. Created and supported by the PSMA Packaging Committee, the Symposium encompasses additive, embedded, co-designed, and integrative packaging technologies. Sessions will address mechanical, materials, reliability, and manufacturability issues in deploying smart power-dense components and modules.

3D-PEIM is an excellent opportunity to learn about leading-edge R&D innovations in 3D power packaging. The focus of the Symposium will be on additive, embedded, co-designed, and integrative packaging technologies. The Symposium will emphasize the need to address mechanical, materials, reliability, and manufacturability issues in small, smart, power-dense components and modules.

The conference will feature invited papers highlighted by plenary and keynote addresses by Industry and Academia experts. There will be Exhibits, and NEW THIS YEAR, an Exhibit Sponsors Session. The symposium is being organized by the Power Sources Manufacturers Association (www.psma.com).

General Chair Professor Tsuyoshi Funaki states, “I am glad we are the first to host the 3D-PEIM Symposium outside the USA. It is very appropriate that 3D-PEIM 2021 is held here because there are many power device and peripheral packaging material manufacturers in Japan. We are planning on providing an amazing on-site or virtual experience for all attendees. I also believe that all attendees will gain significantly advanced packaging knowledge through discussions at this event”.

If you are interested in becoming an Exhibit Partner, please contact info@3D-PEIM.Org, or the PSMA office at power@psma.com.  We look forward to seeing you in Osaka university in June 2021

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Prof. Tsuyoshi Funaki, Osaka University, Japan General Chairman
Prof. Katsuaki Suganuma, Osaka University, Japan Technical Program Co-Chairman	Dr. Minoru Ueshima, Senior Manager, Daicel, Japan Technical Program Co-Chairman	Prof. Guo-Quan Lu, Virginia Tech, U.S.A. Technical Program Co-Chairman

Other Organizing Committee Members

Prof. Patrick McCluskey, University of Maryland U.S.A. – Past General Chairman and Assistant to General Chair
Dr. Minoru Ueshima, Daicel Corporation, Japan – Assistant to Technical Program Co-Chairman
Brian Narveson, Narveson Consulting, U.S.A – Finance Chairman
Arnold Alderman, Anagenesis, Inc. U.S.A. – Publicity Chairman
John Bultitude, Kemet USA – Publications Chairman
Prof. Doug Hopkins North Carolina State University, U.S.A. – Past General Chairman and advisor
Joe Horzepa, U.S.A. – Executive Director of PSMA
John Horzepa,  PSMA, U.S.A – Webinar Technical Support