International Symposium on
3D Power Electronics Integration and Manufacturing

June 25-27, 2018

Adele H. Stamp Student Union, University of Maryland, College Park, MD USA

PACKAGING is a Design Function
MANUFACTURING provides the Design Rules

Following on the success of the inaugural symposium in 2016, the Second International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-18) will be held on June 25-27, 2018.  This symposium, to be held at the University of Maryland, College Park will bring together world-class experts representing a wide range of disciplinary perspectives to advance the development of future 3D power electronics systems.  The focus will be on additive, embedded, co-designed, and integrative packaging technologies and the symposium will emphasize the need to address mechanical, materials, reliability, and manufacturability issues in small, smart, power dense components and modules.

The conference will feature 26 invited lectures highlighted by a keynote address by Prof. Mark Johnson of the University of Nottingham, who is the Director of the EPSRC Center for Power Electronics.  There will also be three tutorials, eight sessions that include contributed presentations, exhibits, and an interactive poster/demonstration session. The symposium is being organized by the Power Sources Manufacturers Association (www.psma.com), and will be chaired by Prof. Patrick McCluskey of the University of Maryland, College Park.

If you are interested in learning more, please contact info@3D-PEIM.Org, or the PSMA office at power@psma.com.  I look forward to seeing you in College Park this coming June.

Prof. Patrick McCluskey
General Chair, 3D-PEIM Symposium 2018