The Third International Symposium on
3D Power Electronics Integration and Manufacturing

3D-PEIM 

Initially planned for June 2020, Osaka University, Japan
Postponed Due to Coronavirus Threat until June 21-23 2021 at Osaka University

Post Marked 3/9/2020

The 3D-PEIM 2020 Steering Team met last Friday to realistically assess the possible impact that the COVID-19 (Coronavirus) would have on our June 2020 Symposium. Presently there are many companies, universities, and countries banning travel. We expect that it may most likely become worse. Since we felt that we do not know what the situation will be in three months or six months, our decision is to postpone our Third Biennial 3D-PEIM Symposium until June 21 – 23, 2021.

We remain committed to holding the Symposium at Osaka University in Japan on our new date. Thanks to the Speakers, Session Chairs, and Members of the Technical Program Committee and Steering Committee that have worked hard and contributed to building an excellent technical program. We want to retain our original Program if possible. So we are encouraging those committed to our previous June 2020 event to remain committed to or to re-commit to our postponed 3D-PEIM Symposium in 2021. We intentionally set a firm date so that you could plan appropriately once the crisis is over.


The Third International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-20) will be held on June 21-23, 2021.  This symposium will be held at the Osaka University, Suita Campus in Japan. This is the first time to have this symposium outside the USA. It will include worldwide experts representing a wide range of disciplinary perspectives to advance the development of future 3D power electronics systems. Asia is the factory of the world and has a big customer base for advanced power electronics technology. 3D-PEIM is an excellent opportunity to learn about leading edge R&D innovations in 3D power packaging. The focus of the symposium will be on additive, embedded, co-designed, and integrative packaging technologies and the symposium will emphasize the need to address mechanical, materials, reliability, and manufacturability issues in small, smart, power dense components and modules.

The conference will feature invited lectures highlighted by a keynote addresses from Industry experts.  There will also be tutorials, technical sessions that include contributed presentations, exhibits, and an interactive poster/demonstration session. The symposium is being organized by the Power Sources Manufacturers Association (www.psma.com), and will be chaired by Prof. Tsuyoshi Funaki of the Osaka University, Japan.

If you are interested in learning more, please contact info@3D-PEIM.Org, or the PSMA office at power@psma.com.  We look forward to seeing you in Osaka university in June 2021

                                                                                  

Prof. Tsuyoshi Funaki, Osaka University, Japan
General Chairman

Prof. Katsuaki Suganuma, Osaka University, Japan
Technical Program Co-Chairman

Dr. Minora Ueshima, Senior Manager, Daicel, Japan
Technical Program Co-Chairman
Prof. Guo Quan Lu, Virginia Tech, U.S.A.
Technical Program Co-Chairman

Other Organizing Committee Members

Prof. Patrick McCluskey, University of Maryland U.S.A. – Past General Chairman and Assistant to General Chair
Dr. Minoru Ueshima, Daicel Corporation, Japan – Assistant to Technical Program Co-Chairman
Brian Narveson, Narveson Consulting, U.S.A – Finance Chairman
Arnold Alderman, Anagenesis, Inc. U.S.A. – Publicity Chairman
John Bultitude, Kemet USA – Publications Chairman
Prof. Doug Hopkins North Carolina State University, U.S.A. – Past General Chairman and advisor
Joe Horzepa U.S.A. – Executive Director of PSMA

If you wish to be a member of the Technical Program Committee, please e-mail the PSMA Office power@psma.com.

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