International Symposium on
3D Power Electronics Integration and Manufacturing
3D-PEIM 2020
The 3D-PEIM Symposium will be held at Osaka University, Japan
to be held 3 Days in June of 2020
Prof. Tsuyoshi Funaki, Osaka University, Japan |
|
 Prof. Katsuaki Suganuma, Osaka University, JapanTechnical Program Co-Chairman |
 Prof. Guo Quan Lu, Virginia Tech, U.S.A.Technical Program Co-Chairman |
Other Organizing Committee Members
Prof. Patrick McCluskey, University of Maryland U.S.A. – Past General Chairman and Assistant to General Chair
Dr. Minoru Ueshima, Daicel Corporation, Japan – Assistant to Technical Program Co-Chairman
Brian Narveson, Narveson Consulting, U.S.A – Finance Chairman
Arnold Alderman, Anagenesis, Inc. U.S.A. – Publicity Chairman
John Bultitude, Kemet USA – Publications Chairman
Prof. Doug Hopkins North Carolina State University, U.S.A. – Past General Chairman and advisor
Joe Horzepa U.S.A. – Executive Director of PSMA
If you wish to be a member of the Technical Program Committee, please contact any of the organizers or this website.
3D-PEIM 2018
June 25-27, 2018
Adele H. Stamp Student Union, University of Maryland, College Park, MD USA
PACKAGING is a Design Function
MANUFACTURING provides the Design Rules
PSMA Sponsored second International Symposium on 3D Power Electronics Integration and Manufacturing (3D PEIM) was another success! On June 25-27, 2018, over 70 participants, 22 from outside the US, attended the event in College Park, Maryland.
Prior to the technical program, three tutorials were given by leading experts on additive manufacturing and power electronics system integration: “Additive Manufacturing” by Prof. Christopher Williams of Virginia Tech; “System Integration” by Prof. Douglas Hopkins of NC State University; and “Integrated Thermal Packaging” by Prof. Michael Ohadi of University of Maryland. Attendee reviews of the tutorials were outstanding with over 90% feeling that they increased their knowledge from the Symposium.
The Symposium opened with two outstanding keynote talks given by two leading researchers in power packaging: “Small, Quiet, Robust, and Affordable: Delivering the Integrated Promise” by Prof. Mark Johnson, University of Nottingham, UK; and “Embedding Technologies for Planar Power Electronics Modules” by Prof. Rolf Aschenbrenner, Fraunhofer Institute-Berlin, Germany.
Attendees were able to attend every presentation in the 3DPEIM high-value single-track technical program featuring 34 oral presentations divided into eight topical sessions, each with a keynote speaker followed by three invited/contributed talks. Over 80% of the oral talks were invited. The presenters and attendees engaged in lively discussions during the sessions and had many networking breaks. In addition, 19 posters were displayed during a meaningful interactive session with the displaying students. Participant feedback stated that 90% of attendees felt the presented material was high quality and they were interested in attending a future 3D-PEIM Symposia.
The presentations from this Symposium are available to PSMA members and Symposium attendees until April 30, 2019 after which they will be available to the public.
The Symposium was sponsored by the Power Sources Manufacturers Association (www.psma.com), with IEEE EPS as a technical sponsor. It was also support financially by 2 industry sponsors, Pink GmbH and Kemet, plus 3 academic sponsors, CALCE at University of Maryland, CPES at Virginia Tech, and the FREEDM Systems Center at NCSU.
Planning for 3D-PEIM 2020 has begun. If you are interested in participating or sponsoring, please contact info@3D-PEIM.Org, or the PSMA office at power@psma.com.
A special thanks to Prof. Patrick McCluskey, General Chair (in photo on right) and Prof. G-Q. Lu, Technical Program Chair (on left)
