The Fourth International Symposium on
3D Power Electronics Integration and Manufacturing

3D-PEIM 

February 1-3, 2023 
Hosted by Florida International University, Miami, FL, USA
Registration is Now Open

PSMA announces the Fourth Biennial International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM-23), held Feb 1-3, 2023. This Symposium brings synergistic advances in component design and integration combined with 3D manufacturing technologies – customized to different market segments such as computing, automotive industry, energy sector, and low-power medical and wearables systems.

Since the status of the COVID-19 pandemic next February is unforeseen, we have cautiously decided to hold an in-person event, but the recording of all presentations will be available to all paid registrants after the Symposium

Miami is one of Florida’s – and the world’s – most popular vacation spots. Though destinations often are said to offer something for everyone, the Miami area does indeed offer multiple enticements for everyone: The trendy nightlife of South Beach, bejeweled by the eye candy of the Art Deco district. The bustle of Calle Ocho and the highly caffeinated energy of Little Havana. The plush hotels of Miami Beach and the historic hideaways of Coral Gables. Seemingly endless shopping opportunities in modern, sprawling malls and the quiet, personal attention offered by the family-owned shops of Coconut Grove and many other corners of the region.

The great outdoors offers its myriad of fun possibilities. Get out on the water to experience Greater Miami from a different perspective aboard an airboat tour in the Everglades or on a Millionaire’s Row cruise through Biscayne Bay aboard the Island Queen. Or, you can simply rent a paddleboard or kayak and experience the unique aquatic ecosystems up close. FIU’s Modesto Maidique Campus (MMC) is readily accessible from Miami and Fort Lauderdale international airports. Miami International Airport (MIA) is approximately 11 miles from MMC. Fort Lauderdale-Hollywood International Airport (FLL) is approximately 37 miles from MMC.

The technical program continues to build on 2016, 2018, and 2021 Symposia’s success, as 3D-PEIM- again assembles world-class experts representing a far-reaching range of cross-disciplinary perspectives exploring the path to design, development, and manufacturing of future 3D power electronics systems. Created and supported by the PSMA Packaging & Manufacturing Committee, the Symposium encompasses integrated voltage regulators, Multiphysics Design Tools, Additive Manufacturing, Packaging Materials, Embedded Power Modules, Passive Component Integration, and Design for Reliability. In deploying smart power-dense components and modules, sessions will address mechanical, materials, reliability, and manufacturability issues.

There will be Awards for Best Student/Post-Doctorate Presentation and Poster at 3D-PEIM 2023.

The conference will feature invited papers highlighted by plenary and keynote addresses by Industry and Academia experts. There will be Exhibits and an Exhibit Sponsors Session. The Symposium is being organized by the Power Sources Manufacturers Association (www.psma.com) Packaging & Manufacturing Committee. Examples of technologies that will be discussed are shown below. The Program at a Glance can be found at Program – 3D PEIM (3d-peim.org).

Exhibit Partnership Opportunities With Virtual Tabletop

Each Exhibit Partner has the opportunity to present products at the Symposium and on a 3D-PEIM Virtual Tabletop Website page. To learn more and sign up to be an Exhibit Partner, go to http://www.3d-peim.org/sponsors-exhibitors//.

Call for Papers

If you would like to submit a contributed paper for presentation at the Symposium, the Call for Papers submission site is open from May 23, 2022, until October 15, 2022, at www.3d-peim.org/call-for-papers/.

Join our mailing list to stay informed of the latest news and information for 3D-PEIM 2023 and future 3D-PEIM Events!  

General Chairman

Prof. P M Raj
Florida International University

Technical Program Co-Chairs

	John Bultitude Kemet Corporation	Vanessa Smet Georgia Tech

Other Organizing Committee Members
Brian Narveson, Narveson Consulting, U.S.A – Finance Chair
Arnold Alderman, Anagenesis, Inc. U.S.A. – Publicity Chair
Devarajan Balaraman, Wolfspeed, USA – Partner Chair
Sk Yeahia Been Sayeed, U.S.A. – Publications Chair
Roman Sosa, Georgia Tech, U.S.A. – Publications Co-Chair
Joe Horzepa, U.S.A. – Executive Director of PSMA
John Horzepa,  PSMA, U.S.A – Technical Support
Prof. Patrick McCluskey, University of Maryland U.S.A. – Past General Chair and Assistant to General Chair
Prof. Doug Hopkins North Carolina State University, U.S.A. – Past General Chair and advisor

Diamond Exhibit Partners: