The Third International Symposium on
3D Power Electronics Integration and Manufacturing
3D-PEIM
June 21-23 2021
Virtual Symposium Hosted by Osaka University, Japan
The third International Symposium on 3D Power Electronics Integration and Manufacturing (3D PEIM) was another success! On June 21-23, 2021, 75 international participants from Asia, Europe and the Americas attended a 100% virtual 3-day symposium. In spite of COVID-19 restrictions requiring the Japan hosted symposium to go fully virtual, all registered and speaking participants were in attendance.
The Symposium attendees received great insight from each of the plenary presentations given by leading experts in power electronics: “Optimal modularization technology for the latest WBG devices” by Yoshikazu Takahashi, Tohoku University, Japan, “Automotive Semiconductors in the CASE era and its ‘Jisso’ technologies” by Yasushi Shinojima, MIRISE Technologies Corporation, “Materials and Technologies for Power Electronic Module” by Prof. Dr.-Ing. Habil Hans-Jürgen Albrecht, IAVT TU, “Diamond Devices Based on Unique Material Properties” by Toshiharu Makino, AIST, Advanced Power Electronics Research Center, “Applications with SiC Power Devices for Railcar” by Tomonobu Mihara, Mitsubishi Electric Corporation, and “Reliability Aspects of 3D Integrated Power Devices” by Dr. Josef Lutz, Professor at Chemnitz University of Technology.
The Symposium Sessions were kicked off with outstanding keynote talks given by leading experts in power packaging: “Thermal Fluid Simulation Modeling and Structural Analysis of Double-sided Cooling Power Module Based on Thermal Transient Test” by Tom Hara, Siemens Digital Industries Software, “Developments of High Power Blue Diode Laser Systems for Laser Metal Deposition and Selective Laser Melting in Additive Manufacturing” by Masahiro Tsukamoto, Joining and Welding Research Institute, Osaka University, “Development of High Performance SiC Power Module” by Dr. Hiroshi Yamaguchi, National Institute of Advanced Industrial Science and Technology (AIST), “Superior Reliability of Power Electronic Packages with Die Top Systems (DTS®). Why a Wire-Based Technology Solution Outperforms Clip-Based Interconnections” by Michael Joerger, Heraeus Electronics, and “The Technology Race in Power Electronics Packaging: The race is on!” by Rainer Frauwallner AT & S Austria Technologie & Systemtechnik Aktiengesellschaft.
The keynotes were followed by a single-track technical program featuring 21 invited oral presentations divided into seven topical sessions, several with a keynote speaker followed by invited/contributed talks. The presenters and attendees engaged in lively discussions during the question periods in each session. In addition, 100% of participant feedback stated that attendees felt the presented material was high quality and were interested in attending a future 3D-PEIM either in person or virtually.
The videos and pdf’s of the presentations are available to all registered attendees and through post conference registration at Registration – 3D PEIM (3d-peim.org).
The Symposium was sponsored by the Power Sources Manufacturers Association (www.psma.com), and chaired by Prof. Tsuyoshi Funaki, Osaka University, Japan. IEEE EPS was a technical sponsor and financial support was provided by nine industry sponsors.
Prof. Tsuyoshi Funaki, Osaka University, Japan |
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 Prof. Katsuaki Suganuma, Osaka University, JapanTechnical Program Co-Chairman |
 Dr. Minoru Ueshima, Senior Manager, Daicel, Japan Technical Program Co-Chairman |
 Prof. Guo-Quan Lu, Virginia Tech, U.S.A.Technical Program Co-Chairman |
Other Organizing Committee Members
Prof. Patrick McCluskey, University of Maryland U.S.A. – Past General Chairman and Assistant to General Chair
Dr. Minoru Ueshima, Daicel Corporation, Japan – Assistant to Technical Program Co-Chairman
Brian Narveson, Narveson Consulting, U.S.A – Finance Chairman
Arnold Alderman, Anagenesis, Inc. U.S.A. – Publicity Chairman
John Bultitude, Kemet USA – Publications Chairman
Prof. Doug Hopkins North Carolina State University, U.S.A. – Past General Chairman and advisor
Joe Horzepa, U.S.A. – Executive Director of PSMA
John Horzepa, PSMA, U.S.A – Webinar Technical Support
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