2023 3D-PEIM Keynote Speakers

Speaker Topic
Michael Hill, Intel Practical challenges with advanced IVR solutions for microprocessors
Vanessa Smet, Georgia Tech Machine-learning-based optimization: the future of power package design
Rajen Murugan, Texas Instruments Multiphysics System Co-Design Modeling: State-of-the-Art, Challenges, and Opportunities
Matt Kelly, IPC Insights from Microelectronic Packaging for Power Packaging Advancement
Gordon Elger, Fraunhofer Application Center Roadmap for Copper Sintering – Next Interconnect for Power Electronic Module Packaging
Habib Mustain, Heraeus Die Top System: Advanced interconnect for Power Electronics Module Packaging
G. Q. Lu, Virginia Tech A Polymer-Nanoparticle Composite for Nonlinear Resistive Field-Grading in Medium-Voltage Power Modules
Satish Kumar, Georgia Tech Integrated thermal management in power electronics and motors
Matt Wilkowski, EnaChip Enabling Sustainable Power Electronics Through Miniaturization and Integration of Power Magnetics
Mike Hayes, Tyndall eSiP (energy source in package) – 3D packaging considerations for self-powered IoT edge devices

Plenary Speakers

Program

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