2023 3D-PEIM Keynote Speakers

Speaker Topic
Michael Hill, Intel IVR
Minjie Chen, Princeton University IVR and Vertical Power Delivery
Madhavan Swaminthan, Georgia Tech – PRC Machine Learning-based Optimization
Rajen Murugan, Texas Instruments Multiphysics Modeling
Brij Singh, John Deere Power Module Manufacturing Advances
Patrick McCluskey, University of Maryland Thermal management and reliability
Jaim Nulman, Nano Dimension Additive Manufacturing
Osama Mohammad, Florida International University Advanced Topologies
Matt Kelly, IPC Power Module Manufacturing Advances
Thomas Foulkes, Pacergy 3D Printed PCBs
Srikrishna Bhogaraju, Technical University of Ingolstadt Cu sintering interconnect analysis
Habib Mustain, Heraeus Power Interconnects
Matt Wilkowski, Enachip Wafer-Integrated Inductors
Guo-Quan Lu, Virginia Tech. Nonlinear Resistive Field-Grading in Medium-Voltage Power Modules
Lynn Petersen, Office of Naval Research Navy Power Electronics Needs
Mohamed Jatlaoui, Murata High-density nanoporous silicon decoupling capacitors
Noah Sturcken, Ferric Inc. 3D power delivery for high-performance processors
Mike Hayes, Tyndall National Institute Power Harvesting for IoT and sensor networks

Plenary Speakers

Program

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