| Speaker |
Topic |
| Michael Hill, Intel |
IVR |
| Minjie Chen, Princeton University |
IVR and Vertical Power Delivery |
| Madhavan Swaminthan, Georgia Tech – PRC |
Machine Learning-based Optimization |
| Rajen Murugan, Texas Instruments |
Multiphysics Modeling |
| Brij Singh, John Deere |
Power Module Manufacturing Advances |
| Patrick McCluskey, University of Maryland |
Thermal management and reliability |
| Jaim Nulman, Nano Dimension |
Additive Manufacturing |
| Osama Mohammad, Florida International University |
Advanced Topologies |
| Matt Kelly, IPC |
Power Module Manufacturing Advances |
| Thomas Foulkes, Pacergy |
3D Printed PCBs |
| Srikrishna Bhogaraju, Technical University of Ingolstadt |
Cu sintering interconnect analysis |
| Habib Mustain, Heraeus |
Power Interconnects |
| Matt Wilkowski, Enachip |
Wafer-Integrated Inductors |
| Guo-Quan Lu, Virginia Tech. |
Nonlinear Resistive Field-Grading in Medium-Voltage Power Modules |
| Lynn Petersen, Office of Naval Research |
Navy Power Electronics Needs |
| Mohamed Jatlaoui, Murata |
High-density nanoporous silicon decoupling capacitors |
| Noah Sturcken, Ferric Inc. |
3D power delivery for high-performance processors |
| Mike Hayes, Tyndall National Institute |
Power Harvesting for IoT and sensor networks |
