The Third International Symposium on
3D Power Electronics Integration and Manufacturing

June 22-24, 2020
Osaka University, Osaka, Japan

Members of the worldwide electronics community are encouraged to submit abstracts for the third international symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM). This symposium will bring together practitioners and researchers to share, discuss, and roadmap the latest developments in circuits and systems enabled through advancements in 3D packaging, integration, and manufacturing technologies. The symposium will have a full program of keynotes, invited presentations, contributed papers, interactive sessions, table-top exhibits, and laboratory tours.

Contributed papers are sought that address important challenges related to the packaging and manufacturing of smaller, lighter, more efficient, and sustainable power electronic products, especially in the following topic areas:

  • Additive Manufacturing
  • Embedded Components and Embedding Technologies
  • Systems Integration and Thermal Management for High-density Packaging
  • Multiphysics Modeling and Simulation of Integrated Packaging and Circuit Solutions
  • Materials (e.g., interconnects, encapsulants, substrates)
  • Heterogeneous Integration
  • Manufacturability of circuits and packaging (manufacturing processes, equipment, and standards)
  • Quality and Reliability, including Prognostics and Condition Monitoring

ABSTRACT FORMAT:The abstract should consist of two pages of text with sections on the purpose of the study, the approach,  the results and the significance to power electronics community, plus one page of figures, tables, and references.

ABSTRACT DEADLINE: January 20, 2020
• Submission information

Questions pertaining to the 3D-PEIM Symposium may be addressed to:

General Chair:
Prof. Tsuyoshi Funaki, Osaka Univ. (

Technical Program Co-Chairs:
Prof. Katsuaki Suganuma, Osaka Univ. (
Prof. Guo-Quan Lu, Virginia Tech (

Past General Chairs:
Prof. Patrick McCluskey, Univ. of Maryland (
Prof. Douglas Hopkins, NC State Univ. (