Submission information

Call for Papers 3D-PEIM 2023

The Fourth International Symposium on 3D Power Electronics Integration and Manufacturing 3D-PEIM Welcome – 3D PEIM ( will be held February 1-3, 2023, at Florida International University, Miami, FL, USA.  This symposium is sponsored by the Power Sources and Manufactures Association (PSMA) and will cover synergistic advances in component design and integration combined with 3D manufacturing technologies for power electronics packaging.  Technical Co-Chairman Dr John Bultitude and Venessa Smet invite Industry, Academia, and Government to submit abstracts on the following technologies.

IVR for Computers and Servers      Multiphysics Design & Tools
Additive Manufacturing Manufacturing Technologies
Materials I Interconnects & Lead Attachments  High Power Module Integration
Materials II Substrates & Encapsulants  Passive Component Integration
Thermal Management and Reliability    Low Power & Telemetry

Invited plenary and keynote addresses will be made from Industry and Academic experts. Plenary presentations will be made by Professor Fred C. Lee, Virginia Tech, USA will present on “PCB based Integrated Magnetics” and Professor and Katsuaki Suganuma, University of Osaka, Japan on “Superior heat dissipation by low pressure Ag sinter joining and real time AI lifetime prediction for SiC power module”.

We are also very interested in receiving proposals for presentations from academia, industry and government that describe advances and research in these technologies.  Students are encouraged to submit abstracts on their work in these areas.   Please submit your abstracts from May 23, 2022, via the website link Submission information – 3D PEIM (  Abstracts will be accepted until July 11, 2022, and acceptance notifications will be made by October 10, 2022.  We encourage presenters to publish their work and those that wish to do this will be able to submit papers that will be published by IEEE Explore as proceedings after the conference.

On behalf of the Technical Committee, we look forward to receiving your abstracts that will help us make this another successful 3D-PEIM Symposium. For additional information contact Dr John Bultitude, Technical Program Co-Chair.

The timeline for submissions is:

  1. Call For Papers – now
  2. Abstract Submission Open (E-papers) – May 23, 2022
  3. Abstract Submission Deadline – July 11, 2022
  4. Acceptance Notification – October 10, 2022
  5. Paper Submission Deadline – December 12, 2022
  6. IEEE Publication – February 10, 2023