Sponsorship Benefits
Thank you for visiting the sponsors and exhibitor tab for 3D-PEIM 2020. The Symposium will provide an excellent chance for your company or organization to interface directly with an international audience focused on high density 3D Packaging, Engineering, Integration and Manufacturing (3D-PEIM). The objective is to bring together experts for all 4 areas to discuss how these four disciplines should work as a team during the product development process to provide the optimal high density power solutions. Our sponsors are key to providing exhibits and attendees to maximize the benefit of everyone attending. From the table above you can see the benefits of various sponsorship levels. Thank you for considering sponsorship and helping make 3D-PEIM possible.
Start your registration by clicking the “Register Here” button below. This will take you to our registration website. Registration is a two step process of first registering with the website, then registering for the symposium. Once on the symposium registration page Click the “Sponsor Registration” button to register as a sponsor. Fill out the appropriate information including the level of sponsorship you would like. Once registration is complete you will receive an email from the Symposium Chairman Dr. Tsuyoshi Funaki with instructions on how to pay by wire transfer. He will provide an invoice and information on how to register the attendees you are entitled to and where and what information you should send to be recognized as a sponsor on the website, in the program and during the symposium. Any questions you have should be directed to Dr. Funaki at funaki@eei.eng.osaka-u.ac.jp .
Media Partners:
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Organizing, Financial and Technical Partners:
CPES
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Daicel Corporation
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IEEE Electronics Packaging Society (EPS)
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OSAKA University
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PSMA |
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