| Session |
Chair |
| S2: IVR for Computers and Servers |
Siddarth Ravichandran, Chipletz |
| S3: Multiphysics Design & Tools |
Rajen Murugan, Texas Instruments |
| S4: Additive Manufacturing |
Peter Friedrichs, Infineon |
| S5: Manufacturing Technologies |
Jason Rouse, Taiyo America |
| S7: Materials I Interconnects & Lead Attachments |
Andy Mackie, Indium Corporation |
| S8: Materials II Substrates & Encapsulants |
Ninad Shahane, Texas Instruments |
| S9: Module Integration |
Vanessa Smet, Georgia Tech. |
| S11: Thermal Management and Reliability |
Patrick McCluskey, University of Maryland |
| S12: Passive Component Integration |
John Bultitude, KEMET Corporation |
| S13: Low Power & Telemetry |
Girish Wable, Jabil |
| S15: Tour of FIU Labs |
Markondeyaraj Pulugurtha, Florida International University |
