2021 3D-PEIM Invited Speakers

Session 2: System Integration & Thermal Management

Title: Inevitability of Near Chip-Scale High Power GaN & SiC Packages Replacing Even Newer WBG Traditional Modules

Author: Courtney Furnival   Presenter: Arnold Alderman

Courtney Furnival, is a designer/inventor with five decades of experience in almost every aspect of power electronics packaging from packaging design; to building and qualifying prototypes; to developing manufacturing processes; to high-yield/high-volume product. He has packaged power, MOSFETs, IGBTs, GaN discrete devices and power modules. Most recently he has designed power QFN & LGA WBG packages for both GaN & SiC products. He has patented unique Near chip-scale power WBG mMaxPak packages architecture to replace large power industrial modules, and confirmed feasibility of extending them to EV & Locomotive Traction products.

Session 2: System Integration & Thermal Management

Title: Opportunities and Challenges of Integrated WBG Power Electronics Development

Author: Alberto Castellazzi

Prof. Castellazzi has been active in power electronics research and development for over 20 years and has had extensive collaborations with major industrial and academic research laboratories internationally. He has authored or co-authored over 200 papers published in peer-reviewed specialist journals and conference proceedings. His main research interests are the enabling technologies of solid-state power processing. Prof. Castellazzi is a member of the Technical Programme Committee of the ISPSD, WiPDA-Asia, IRPS, ECSCRM and ESTC conferences.

Session 2: System Integration & Thermal Management

Title: Thermal Solution for Cooling of Electronic Equipment Using Lotus-type Porous Copper Heat Sink

Author: Tetsuro Ogushi

(1) The March, 1971:Graduation of department of physics of Kyushu University.
(2) 1971 ~ 2006: Advanced technology R&D Center of Mitsubishi Electric Corporation.
(3) 1987: Doctor of Engineering. (Kyushu University).
(4) 2007 ~ 2013 Professor of Hiroshima International University.
(5) 2014 ~ 2016 Guest professor of Hiroshima International University.
(6) 2016 ~ Thermal Project Manager of Lotus Thermal Incorporation.
Specialty: Cooling technology of the electronic equipment, Heat pipe, Contact thermal resistance

Session 2: System Integration & Thermal Management

Title: Investigation of BTI-induced Threshold Voltage Shift for Power MOSFETs during Switching Operation

Author: Michihiro Shintani

Michihiro Shintani received B.E. and M.E. degrees from Hiroshima City University, Hiroshima, Japan, and a Ph.D. degree from Kyoto University, Kyoto, Japan, in 2003, 2005 and 2014, respectively. He was with Panasonic Corporation, Osaka, Japan, from 2005 to 2014, with Semiconductor Technology Academic Research Center (STARC), Yokohama, Japan, from 2008 to 2010, and with Kyoto University, Kyoto, Japan. In 2017, he joined the Graduate School of Information Science, Nara Institute of Science and Technology (NAIST), where he is currently an assistant professor. His research interests include reliability-aware circuit design, device modeling, and circuit simulation for VLSI and power converters. He s a senior member of IEEE.

Session 3: Multiphysics Design & Tools

Title: Diamond MOSFET for Next-Generation Power Devices

Author: Tsubasa Matumoto

Tsubasa Matsumoto received his Ph.D. degree in Engineering from the University of Tsukuba in 2014. From 2014 to 2015, he was a postdoctoral researcher at the National Institute of Advanced Industrial Science and Technology (AIST). Then, he moved to the Kanazawa University. In 2016, he succeeded in demonstration of an inversion-mode diamond MOSFET. He is now an associate professor at the Nanomaterials Research Institute, Kanazawa University.

Session 3: Multiphysics Design & Tools

Title: Lifetime Prediction Simulation System for the Next Generation Power Semiconductor Module Using Silver Sintering Die Attach

Author: Kenihi Ohura

Ohura has been involved with the development and implementation of the lifetime prediction simulation code for the next generation power semiconductor modules as a development manager of Advanced Simulation of Mechanics. Co. Ltd.(ASTOM). Recently, He has been promoting the joint research and development of the integrated solution of testing equipment and numerical simulation combined by neural network.

Session 3: Multiphysics Design & Tools

Title: TAPIR (compacT and modulAr Power modules with IntegRated cooling) Technology: Goals and Challenges

Author: Yvan Avenas

Yvan Avenas is Associate Professor at Grenoble Institute of Technology (France) since 2005. He received the PhD degree from this institute in 2002. He carries out his research activities in Grenoble Electrical Engineering Lab (G2Elab) and is co-head of the power electronics group since 2015. He works on thermal management and 3D packaging of power electronics. He is also interested in thermal characterization of power semiconductor devices.

Session 4: Additive Manufacturing

Title: Novel Sintering Process Technology to Achieve Highest Yield and Quality

Author: Dirk Busse


  • 1986-1988 Apprenticeship as precision mechanic at the Academy of Sciences of the GDR
  • 1991-1997 Study of mechanical engineering at the TU-Berlin GermanyDiploma thesis on the subject of FEM simulation of a soft solder joint
  • 1997-2003 leading design engineer and project manager at a Berlin start-up company TECA GmbH (TECA=Technology Oriented Automation)
  • 2003-2009 senior development engineer for automation and soldering technology at the machine manufacturer centrotherm AG
  • from 2009 one of the two founders, shareholder and managing director CEO of budatec GmbH

Session 4: Additive Manufacturing

Title: A Low Inductive Power System in Package with Multilayer Ceramic Substrate and Integrated Active Cooling

Author: Olivier Mathieu

Olivier holds a master degree in material science from Institut National des Sciences Appliquées Rennes, France. Olivier has been with Rogers Corporation since 2006, working first as an application engineer to provide worldwide technical support for metallized ceramic substrates and micro channel coolers. Later he has taken over the head of technical marketing before being appointed product innovation manager for curamik product within Rogers’ PES division.

Session 4: Additive Manufacturing

Title: Power Microtransformer on Silicon Embedded into PCB

Authors: Dragan Dinulovic, Leon Haase, Martin Haug, Juergen Wolf

Dr.-Ing.Dragan Dinulovic studied Mechanical Engineering at University of Nis (Serbia). He received his PhD from Leibniz Universität Hannover (Germany) in Year 2007. His research area was a development of magnetic MEMS. He joined Würth Elektronik eiSos as R&D engineer, where he focusses on development of thin-film inductors and transformers, on integration of passive and active power devices into one package (Power supply in Package (PSiP)) or on chip (Power System on Chip (PwrSoC)) and on Energy Harvesting devices.

Session 6: Manufacturing Technologies

Title: Advanced Photonic Curing: High-Speed Printing and soldering with light

Author: Kurt Schroder

Joining NovaCentrix in 2000, Dr. Kurt Schroder is Chief Technology Officer. Kurt is the inventor of the photonic curing process which is incorporated within all PulseForge tools as well as numerous supporting technologies. Kurt has over 30 years’ experience in plasma physics and pulsed power and has worked in industry, government, and academia. He has been issued 29 US patents, and >25 foreign patents in diverse technology areas. Kurt is a two-time recipient of the prestigious R&D100 award which recognizes the best 100 inventions in the US each year. He was named 2012 Inventor of the Year by the Texas State Bar. He is also the inventor of the antivibration technology contained within most hammers sold in the United States, with sales exceeding $2B. Kurt holds an S.B. in Physics from Massachusetts Institute of Technology and a Ph.D. in Physics from the University of Texas at Austin.

Session 6: Manufacturing Technologies

Title: Cavity Propagation under Pulse Voltages in Silicone Gel for Encapsulation of Power Modules

Authors: Akiko Kumada, Masahiro Sato, & Shin Nakamura

Masahiro Sato received the B.S., M.S., and Ph.D. degrees in electrical engineering from the University of Tokyo in 2012, 2014, and 2017, respectively. Currently, he is an assistant professor at The University of Tokyo. He has been engaged in research on insulation of power modules, photocatalytic water splitting, and high field phenomena in dielectrics.

Session 6: Manufacturing Technologies

Title: Lost-foam Technology for Power Electronics Packaging

Author: Thomas Lei

Dr. Guangyin Lei received his M.S. and Ph.D. degrees from the Department of Materials Science and Engineering, Virginia Tech, in 2005 and 2010, respectively.
Between 2010-2018, Dr. Lei was with Ford Motor Company in Dearborn, Michigan as a research engineer for the development of power module for electrified vehicle applications. In 2018, he joined NIO, a startup EV company in Shanghai, China, responsible of advanced technologies in epowertrain.

In 2020, Dr. Lei joined Fudan University as a full professor, with research focuses on the development of electronics packaging material as well as advanced power modules.
Dr. Lei has over 20 peer-reviewed publications and over 30 US and international patents in electronics packaging.

Session 7: Materials

Title: Space Charge Accumulation Properties in Various Insulating Materials for Power Electronics under DC High Electric Field at High Temperature

Author: Hiroake Miyake

He received his B.E., M.E., and Ph.D. from Musashi Institute of Technology in mechanical engineering. After his Ph.D. he joined Japan Aerospace Exploration Agency as a researcher before moving to Tokyo City University as a Professor. Research interests are in the measurement of secondary electron and photo electron emissions in materials.

Session 7: Materials

Title: Compatibility Assessment of Soft Magnetic Metal-flake Composite Material for PCB Embedding

Author: Keitaro Tanno

Keitaro Tanno received his master’s degree at Tohoku University in 2012, and has over 10 years’ experience in material engineering for inductive and capacitive components. He is currently engaged in the invention of novel magnetic materials suitable for 3D-heterogenious integration in KEMET company.

Session 7: Materials

Title: Characterization and Testing of Organic Substrates to Replace DBC in 1200V Modules

Author: Kenji Nishiguchi

2021—Kenji Nishiguchi is with RISHO Kogyo Co., Ltd.; presently at NC State; and TechDream, Inc., USA
1983— Graduated from Doshisha University industrial chemical high polymer. Joined RISHO Kogyo R&D for Printed Circuit material.
2014— 2021 Engaging for RISHO Tokyo Oversea section Sales and marketing for Printed Circuit material.(Deputy General Manager)

Session 8: Heterogeneous Integration

Title: Advances in Ag Sinter Joining and real-time failure monitoring for WBG Power Device

Author: Chuantong Chen, Zheng Zhang, Tetsu Takemasa, Naoki Wakasugi, Aiji Suetake, Katsuaki Suganuma

Presenter: Chuantong Chen, Osaka University

Chuantong Chen received the M.S. degree in mechanical engineering in 2012 and Ph.D. degree in mechanical engineering from Nagoya Institute of Technology, Japan, in 2015. From 2015 to 2016, he was a Postdoctoral fellow at Institute Scientific and Industrial Research (ISIR), Osaka University, Japan; and Assistant Professor at the ISIR since 2016. He is currently an associate professor in Osaka University. His research interest includes Lead-free-soldering, Ag sinter joining, conductive adhesives, nanoparticles ink technology and power devices design. He received some awards and honors include Best Paper of the Japan Society of Mechanical Engineers (JSME), and IEEE CPMT Japan Chapter Young Award in 2017.

Session 8: Heterogeneous Integration

Title: Flexible Integration of High Power Modules By Means Of IC Embedded Sub Modules

Author: Jean-Marc Yannou,

Jean-Marc Yannou started his career as a Test & Product Engineer at Texas Instruments, first in France then in the USA. He then joined Philips Semiconductors (now NXP) as principal engineer where he managed the company’s initiatives in System-in-Package technologies. Next, he became a senior consultant and market analyst on advanced semiconductor packaging technology for Yole.

Session 8: Heterogeneous Integration

Title: Resumption of contacts by metallic foam Electrical, thermal and reliability performance

Author: Mickaël Petit

Mickael Petit obtained his PHD in 2012 at G2ELAB, University of Grenoble. His work was then oriented towards the use of ferrofluids for cooling power electronics. Since 2013, he is associate professor at CNAM Paris, SATIE laboratory. His research activities revolve around the technologies of burial of power electronics components in the PCB. This work allowed the defense of four PHD. Two are still in progress.

Session 9: Quality & Reliability

Title: Thermal Performance and Reliability Study on Major Designs and Packaging Process of Automobile Power Module

Author: Qiang Yu, Yokohama National University

Finished PhD (Mechanical Engineering) from Yokohama National University in 1992,
Started his research career as associate Professor at YNU from 1992, Professor from 2012.

Research Topics:
Reliability assessment and design for automobile electronics system and power module.
He had organized JSME research consortiums on the thermal and reliability design for electronics packaging for over ten years.

Session 9: Quality & Reliability

Title: Quality Assurance of 3D Power Device Structures with Non-Destructive Imaging Techniques

Author: Steve Martell

Steve Martell is the manager of technical support services at Nordson Electronic Solutions for the Sonoscan products, allowing him to work with companies and standards organizations on an international basis. He has a Mechanical/Ocean Engineering degree from URI and MBA from Chicago Booth.

He Chairs IPC’s B-10a Task Group since 1996. He received the “IPC’s President’s Award” in 2015, and other awards for his leadership of the joint IPC/JEDEC working group that developed J-STD-020, J-STD-033, J-STD-075, etc. He is also working with other international standards organizations, such as JEITA and IEC.

He is a Co-Chair of SEMI MEMS and member of SEMI 3D P&I, HB-LED, PV and Silicon Wafer standards committees. On the aero/military side he Chairs the AM TG on counterfeit parts for SAE G19A, and contributes to SAE G12/JEDEC JC13 committees.

He is the author of over thirty papers and technical publications with a focus on C-SAM technologies and related industry standards.

Session 9: Quality & Reliability

Title: Improvement of Soldering Processes by Big Data

Author: Dr. Aaron Hutzler, Managing Director, AHMT, GmbH

After the study of material science, Dr. Hutzler joined the Fraunhofer IISB, where he worked on soldering, sintering, and wire-bonding. He undertook his Ph.D. focusing on reliability testing of high temperature packages. Later, Dr. Hutzler joined PINK Thermosystems as Head of Applications and developed soldering and sintering processes for mass production. Since 2019 is founder and CEO of the consulting company Bond-Pulse and the datalogger and software company AHMT.

Plenary Speakers Abstracts and Biographies

Keynote Speakers Abstracts and Biographies