3D-PEIM 2023 Program 

3D PEIM 2023 Final Program Book (opens in new tab)

Program at a Glance

Session Chair
S2: IVR for Computers and Servers Siddarth Ravichandran, Chipletz
S3: Multiphysics Design & Tools Rajen Murugan, Texas Instruments
S4: Additive Manufacturing Peter Friedrichs, Infineon
S5: Manufacturing Technologies Jason Rouse, Taiyo America
S7: Materials I Interconnects & Lead Attachments Andy Mackie, Indium Corporation
S8:  Materials II Substrates & Encapsulants Ninad Shahane, Texas Instruments
S9: Module Integration Vanessa Smet, Georgia Tech.
S11: Thermal Management and Reliability Patrick McCluskey, University of Maryland
S12: Passive Component Integration John Bultitude, KEMET Corporation
S13: Low Power & Telemetry Girish Wable, Jabil
S15: Tour of FIU Labs Markondeyaraj Pulugurtha, Florida International University

Keynote Speakers