2023 3D-PEIM Keynote Speakers

Speaker Topic
Michael Hill, Intel Practical challenges with advanced IVR solutions for microprocessors
Vanessa Smet, Georgia Tech Machine-learning-based optimization: the future of power package design
Osama Muhammed, Florida International University New Challenges in Transportation Electrification, Powertrain Drives &  New Power Electronics Architectures
Rajen Murugan, Texas Instruments Multiphysics System Co-Design Modeling: State-of-the-Art, Challenges, and Opportunities
Satish Kumar, Georgia Tech Integrated thermal management in power electronics and motors
Matt Kelly, IPC Insights from Microelectronic Packaging for Power Packaging Advancement
Gordon Elger, Technische Hochschule Ingolstadt Roadmap for Copper Sintering – Next Interconnect for Power Electronic Module Packaging
Habib Mustain, Heraeus Die Top System: Advanced interconnect for Power Electronics Module Packaging
G. Q. Lu, Virginia Tech A Polymer-Nanoparticle Composite for Nonlinear Resistive Field-Grading in Medium-Voltage Power Modules
Christina DiMarino, Virginia Tech Substrate Technologies for Medium-voltage SiC Power Modules
Travis Anderson, US Navy Power Electronic Materials and Devices: Silicon to Diamond
Patrick McCluskey, University of Maryland Heterogeneous Roadmap Update
Wendy Gu, Stanford University Nano Additive Manufacturing of Challenging Materials
Matt Wilkowski, EnaChip Enabling Sustainable Power Electronics Through Miniaturization and Integration of Power Magnetics
Brian Zahnstecher, PowerRox Energy Harvesting at the Edge: When the Package IS the System

Plenary Speakers