3D-PEIM 2023 Call for Papers & Submission Information

Abstracts Deadline is Extended Until September 16th

The Fourth International Symposium on 3D Power Electronics Integration and Manufacturing 3D-PEIM will be held February 1-3, 2023, at Florida International University, Miami, FL, USA.  This symposium is sponsored by the Power Sources and Manufactures Association (PSMA) and will cover synergistic advances in component design and integration combined with 3D manufacturing technologies for power electronics packaging.  Technical Co-Chairman Dr John Bultitude and Venessa Smet invite Industry, Academia, and Government to submit abstracts on the following technologies.

  • IVR for Computers and Servers     
  • Additive Manufacturing
  • Materials I Interconnects & Lead Attachments 
  • Materials II Substrates & Encapsulants 
  • Thermal Management and Reliability   
  • Multiphysics Design & Tools
  • Manufacturing Technologies
  • High Power Module Integration
  • Passive Component Integration
  • Low Power & Telemetry

Invited plenary and keynote addresses will be made from Industry and Academic experts. Plenary presentations will be made by Professor Fred C. Lee, Virginia Tech, USA will present on “PCB based Integrated Magnetics” and Professor and Katsuaki Suganuma, University of Osaka, Japan on “Superior heat dissipation by low pressure Ag sinter joining and real time AI lifetime prediction for SiC power module”.

We are also very interested in receiving proposals for presentations from academia, industry and government that describe advances and research in these technologies.  Students are encouraged to submit abstracts on their work in these areas.

Submission Information

Abstracts will be accepted until September 16, 2022, and acceptance notifications will be made by October 10, 2022. We encourage presenters to publish their work and those that wish to do this will be able to submit papers that will be published by IEEE Explore as proceedings after the conference.

On behalf of the Technical Committee, we look forward to receiving your abstracts that will help us make this another successful 3D-PEIM Symposium. For additional information contact Dr John Bultitude john.bultitude@yageo.com, Technical Program Co-Chair.

To submit papers, click on https://epapers2.org/3d-peim2023.

  1. Check the author information links on the left-hand side.
  2.  Make sure to check the templates.
  3. Create an author account and submit your paper(s)

The timeline for submissions is:

  1. Call For Papers – now
  2. Abstract Submission Deadline – September 16, 2022
  3. Acceptance Notification – October 10, 2022
  4. Paper Submission Deadline – December 12, 2022
  5. IEEE Publication – February 10, 2023