The Sixth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) will be held November 16–19, 2026, at the Skysong in Tempe/Scottsdale, Arizona, USA. This symposium brings together practitioners and researchers in the power electronics industry to discuss, identify, and roadmap developments in circuits and systems enabled through advancements in 3D circuits, packaging, integration, and manufacturing technologies. We invite you to join us and hear from our plenary speakers!
- Madhavan Swaminathan, Pennsylvania State University
- Rinkle Jain, NVIDIA
- Cian O Mathuna, Tyndall National Institute
- Yi Zheng, Applied Materials
- Kaladhar Radhakrishnan, Intel
- Stephen Coates, Yuxuan Semi
Authors are invited to submit abstracts covering the following topics:
| Topic | Description |
| Advanced Packaging & 3D Integrated Modules | 3D, 2.5D, 2D Advanced Packaging, Wafer Level Packaging, Converter Integration, Module Integration, Bonding Technologies, Manufacturing Technologies, WBG + Substrates + Control + Sensing Integration |
| Materials for Advanced Packaging | Materials for 3D Heterogeneous Integration: WBG, Substrate, Insulation, Die Attach, Interconnect and Conductor, Encapsulation, Baseplate, Stress Relieving, Nano-, Emerging, and Magnetic Materials |
| Thermal Management | Active & Passive Cooling Technologies, Single, Double Sided, & Multilevel Cooling Technologies, Cold Plates, Microchannels, Phase Change Materials, Metrology Techniques for Thermal Management |
| Design, Modeling & Simulation | Co-Design, Multiphysics Modeling, AI/Machine Learning, Optimization, Software Tools for 3D Heterogeneous Integration |
| Reliability & Failure Analysis | Reliability of 3D Power Components and Systems, Failure Analysis, Prognostics and State-of-Health Techniques, Metrology Techniques for Reliability Assessments |
| Passive Components | Inductors, Transformers, Capacitors, Sensors, etc. for 3D Power Integration |
| Power Delivery & Energy Storage | Power Distribution Networks, Back-Side Power Delivery, Vertical Power Delivery, Integrated Energy Storage Techniques, Energy Harvesting |
Submission Information
Abstracts will be accepted until May 8, 2026, and acceptance notifications will be made by June 8, 2026. We encourage presenters to publish their work in IEEE Xplore; those that wish to do so will be able to submit their papers as IEEE Xplore conference proceedings after 3D-PEIM concludes.
Download the abstract submission template here.
On behalf of the Technical Committee, we look forward to receiving your abstracts, which will help us make this another successful 3D-PEIM Symposium.
To submit papers, visit: https://epapers2.org/3d-peim2026
- Check the author information links on the left-hand side.
- Make sure to check the templates.
- Create an author account and submit your paper(s).
Important Dates:
- Website Opens for Abstract Submission: April 6, 2026 (1-page text, and 1 page of figures)
- Due Date for Abstract Submission:
May 8, 2026May 15, 2026 (1-week extended) - Notification of Abstract Acceptance: June 5, 2026
- Registration Opens: June 8, 2026
- Submission of Full Paper Drafts: August 7, 2026 (8-page double-column format limit)
- Symposium Date: November 16–19, 2026
