The 3D-PEIM Organizing Committee is pleased to announce the addition of four two-hour short tutorials to the 3D-PEIM conference program.
The Tutorials will take place on Monday afternoon, November 16. There will be 2 sessions and 2 tracks each session:
1 PM – 3 PM:
- Advanced Packaging
George Dogiamis (DECA), Chanyeop Park (ASU), Hongbin Yu (ASU), and Chris Bailey (ASU) - Trends in Magnetic Material Properties to Meet the Challenges of Supporting High-Performance Computing
Matt Wilkowski (Wurth Elektronik)
3 PM – 3:15 PM Coffee break
3:15 PM – 5:15 PM
- Die-Attach by Metal Powder Sintering: The Science and Practice
G.Q. Lu (Virginia Tech) - Digital Twin-Driven Reliability and Prognostics in Power Electronics Systems
Jong Eun Ryu (North Carolina State University)
Panel Session
Following the tutorials, there will be panel session on “Key Challenges for 3D Power Electronics Packaging/Manufacturing” on November 16 (Monday) 5:30 PM – 7:00 PM from academic and industry experts (tentatively confirmed):
- Ravi Mahajan, Intel/HIR Chair
- Doug Hopkins, North Carolina State University/HIR Power Chapter
- Chris Bailey, Arizona State University/HIR Modeling and Simulation Chapter
- Pat McCluskey, University of Maryland/HIR Thermal Chapter
- George Dogiamis, Deca Technologies
- Francesco Carobolante, IoTissimo
